Rogers 3001 bonding film is a thermoplastic chloro-fluorocopolymer and is recommended for bonding low dielectric constant PTFE (Polytetrafluoroethylene) microwave stripline packages and other multilayer circuits.
ULTRALAM® 3908 bondply is used as a bonding medium (adhesive layer) between copper and the dielectric material.
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.
RO3000 series laminates are circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems. The dielectric constant versus temperature of RO3000 series materials is very stable.
Lowest loss commercial laminates (RO3003), Are available in a wide range of Dk (dielectric constant) (3.0 to 10.2)
Are available both with and without woven glass reinforcements, Low Z-axis CTE (24 ppm/C) provides plated through hole reliablity
Low TCDk for electrical stablity versus temperature (RO3003)
Addition of woven glass reinforcement to increase laminate rigidity
Available in same range of dielectric constant options as RO3000® series laminates
RO3203™ Available with Rolled Copper
Industry leading RO4000® hydrocarbon ceramic laminates and prepregs offer superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes.
RO4000 material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. RO4000 series laminates offer a range of dielectric constants (2.55 - 6.15), are available with UL 94 V-0 flame retardant versions.
Optimized cost and RF / microwave performance
Compatible with FR-4 fabrication including multilayer PCB constructions
High thermal conductivity for improved thermal management over traditional PTFE materials
Robust lead-free solder processing compatibility
Low Z-axis CTE for reliable plated through-hole quality
Cellular Base Station Antennas and Power Amplifiers
Microwave point to point (P2P) links,Automotive Radar and Sensors
RF Identification (RFID) Tags,LNB’s for Direct Broadcast Satellites
RT/duroid® 5870 of high frequency laminates are PTFE composites reinforced with glass microfibers. These microfibers are randomly oriented to maximize the benefits of fiber reinforcement in the direction most valuable to circuit producers and in the final circuit applications.
RT/duroid® 5880 high frequency laminates are PTFE composites reinforced with glass microfibers. These microfibers are randomly oriented to maximize the benefits of fiber reinforcement in the direction most valuable to circuit producers and in the final circuit applications.
RT/duroid® 5880LZ filled PTFE composites are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performance weight sensitive applications.
RT/duroid® 6002 microwave materials are a low dielectric constant laminate offering electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
RT/duroid® 6202 high frequency circuit materials are a low loss and low dielectric constant laminate offering electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.
RT/duroid® 6202PR high frequency circuit materials are low loss and low dielectric constant laminates offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable and used for planar resistor applications.
Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity. Due to their electrical and mechanical stability, TMM high frequency laminates are ideal for high reliability stripline and microstrip applications. When compared to alumina substrates, TMM laminates offer key fabrication advantages since it is available copper clad in larger formats, allowing the use of standard PCB subtractive processes
TMM is available in a wide range of dielectric constants ranging from 3 to 13 and available in thicknesses ranging from .015 to .500 in with a thickness tolerance of plus or minus .0015 in.
Wide range of dielectric constants, Excellent mechanical properties. Resists creep and cold flow
Exceptionally low thermal coefficient of dielectric constant, Coefficient of thermal expansion matched to copper allowing for high reliability of plated through-holes
Resistant to process chemicals. No damage to material during fabrication and assembly processes
Thermoset resin for reliable wirebonding, No specialized production techniques required.
TMM 10 and 10i laminates can replace alumina substrates, RoHS compliant, environment friendly