Rogers High Frequency Laminates Product Selector Guide

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Rogers’ high frequency circuit boards can be purchased by contacting a JXTPCB Customer Service Representative:

Tel: 0086-0755-29760917    Fax:0086-0755-23283744   Skype: jxtsales1    Email: sales01@jxtpcb.com  mkt@jxtpcb.com

Laminates - RT/duroid® 5870, 5880, 5880LZ, 6002, 6202, 6006,6010LM, ULTRALAM® 2000, ULTRALAM 3000, TMM® 3,4,6,10,and 10i, RO3003™, RO3035™, RO3203™, RO3006™, RO3206™,RO3010™, RO3210™, RO4003C™, and RO4350B™ high frequency laminates. 

Bonding Film -3001 Prepreg - RO4403™, RO4450B™ and RO4450F™ 

 

Bondply/Prepreg

Thermoset and thermoplastic high performance bonding layers for multilayer board construction using Rogers high frequency and high speed digital materials.

Benefits

  • low loss and dielectric constant control for repeatable electrical performance
  • low z axis expansion for plated through hole reliability, Thermoset bond temps compatible with FR-4 prepregs for low cost manufacturing

Bondply/Prepreg

2929 Bondply

2929 Bondply is an unreinforced hydrocarbon based thin film adhesive system intended for us in high performance, high reliability multi-layer constructions.

Bondply/Prepreg

3001 Bonding Film

Rogers 3001 bonding film is a thermoplastic chloro-fluorocopolymer and is recommended for bonding low dielectric constant PTFE (Polytetrafluoroethylene) microwave stripline packages and other multilayer circuits.

Bondply/Prepreg

COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA)

  • Thermally robust & lead-free solder compatible
  • Low flow during pressure cure
  • Bonds RF PCBs to heat sinks, pallets and housings
Bondply/Prepreg

RO4400™ Series

  • High frequency thermoset prepreg compatible with FR-4 bond temperatures
  • Sequential lamination capable
  • Lead free solder processing compatible
Bondply/Prepreg

ULTRALAM® 3908 Bondply

ULTRALAM® 3908 bondply is used as a bonding medium (adhesive layer) between copper and the dielectric material.

RO3000® Laminates

RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.

RO3000 series laminates are circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems. The dielectric constant versus temperature of RO3000 series materials is very stable.

Benefits

  • Lowest loss commercial laminates (RO3003),  Are available in a wide range of Dk (dielectric constant) (3.0 to 10.2)
  • Are available both with and without woven glass reinforcements,  Low Z-axis CTE (24 ppm/C) provides plated through hole reliablity
  • Low TCDk for electrical stablity versus temperature (RO3003)

Typical Applications

  • Automotive radar applications,Global positioning satellite antennas
  • Cellular telecommunications systems - power amplifiers and antennas
  • Patch antenna for wireless communications,Direct broadcast satellites
  • RFID Tags,Surface mount RF components,E-Band point to point microwave links

RO3000® Laminates

RO3003™ Laminates

  • PTFE/ceramic laminates with exceptional electrical properties and mechanical stability
  • Dielectric constant 3.00(+/-0.04); dissipation factor 0.0013@010GHz
  • Available with Rolled Copper
RO3000® Laminates

RO3006™ and RO3010™ Laminates

  • Higher dielectric constant laminates for reduced circuit size
  • Dielectric constant of 6.15 +/-0.15 for RO3006 laminates and 10.2 +/- 0.30 for RO3010 laminates
RO3000® Laminates

RO3035™ Laminates

  • PTFE/ceramic laminates with exceptional electrical properties and mechanical stability
  • Dielectric constant 3.50 (+/-0.05); dissipation factor 0.0017 @10GHz
  • Available with Rolled Copper
RO3000® Laminates

RO3203™, RO3206™ and RO3210™ Laminates

  • Addition of woven glass reinforcement to increase laminate rigidity
  • Available in same range of dielectric constant options as RO3000® series laminates
  • RO3203™ Available with Rolled Copper

RO4000® Laminates

Industry leading RO4000® hydrocarbon ceramic laminates and prepregs offer superior high frequency performance and low cost circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes.

RO4000 material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. RO4000 series laminates offer a range of dielectric constants (2.55 - 6.15), are available with UL 94 V-0 flame retardant versions.

Benefits
  • Optimized cost and RF / microwave performance
  • Compatible with FR-4 fabrication including multilayer PCB constructions
  • High thermal conductivity for improved thermal management over traditional PTFE materials
  • Robust lead-free solder processing compatibility
  • Low Z-axis CTE for reliable plated through-hole quality

Typical Applications

  • Cellular Base Station Antennas and Power Amplifiers
  • Microwave point to point (P2P) links,Automotive Radar and Sensors
  • RF Identification (RFID) Tags,LNB’s for Direct Broadcast Satellites

RO4000® Laminates

RO4000® LoPro® Laminates

  • Proprietary technology that allows reverse treated foil to bond to standard RO4000 delectric
  • Significantly improves insertion loss and passive intermodulation (PIM) performance
RO4000® Laminates

RO4003C™ Laminates

  • Lowest dielectric loss of the RO4000® product family
  • The original RO4000 material used for over a decade in cost sensitive Microwave/RF designs
  • Dk 3.38 (+/- 0.05); Df 0.0027@10GHz
RO4000® Laminates

RO4350B™ Laminates

  • The market leading material for base station power amplifier designs
  • Low loss, FR-4 processable and UL 94V-0 rated material
  • Dk 3.48 (+/- 0.05); Df 0.0037@10GHz
RO4000® Laminates

RO4360G2™ Laminates

  • First high dielectric constant thermoset FR-4 processable laminate
  • Lower cost alternative to PTFE offerings
  • Dk 6.15 (+/- 0.15); Df 0.0038@10GHz
RO4000® Laminates

RO4450B™ Prepregs (Bondply)

  • Based on RO4000 platform for low Dissipation Factor (.004 @ 10 GHz) and consistent Dielectric Constant (Dk)
  • Fully compatible with FR-4 materials for complex hybrid multilayer designs
  • UL 94-V0 rated
RO4000® Laminates

RO4500™ Laminates

  • Commercial antenna grade series for high volume designs
  • Available with LoPro™ copper for improved passive intermodulation (PIM)
  • Excellent mechanical rigidity for efficient and reliable installation
RO4000® Laminates

RO4700JXR™ Antenna Grade Laminates

  • First RO4000® low dielectric constant antenna grade material available
  • Uses LoPro™ copper for improved passive intermodulation (PIM) with typical values <-164 dBc
  • Dk 2.55 (+/- 0.05), Df 0.0022 @ 2.5GHz and 3.0 (+/- 0.05), Df 0.0023 @ 2.5GHz
RO4000® Laminates

RO4835™ Laminates

  • 10 Times improved oxidation resistance as compared to traditional thermoset laminates
  • Available in all the same configurations and thicknesses as RO4350B™ laminates 
  • Dk 3.48 (+/- 0.05); Df 0.0037@10GHz

RT/duroid® Laminates

RT/duroid high frequency circuit materials are filled PTFE (random glass or ceramic) composite laminates for use in high reliability, aerospace and defense applications.
Benefits

  • Low electrical loss,Low moisture absorption

  • Stable Dk over frequency,Low outgassing for space applications
Typical Applications
  • Airborne and ground based radar systems
  • Millimeter Wave Applications,Military Radar Systems
  • Missile Guidance Systems,Space satellite transceivers

RT/duroid® Laminates

RT/duroid® 5870 Laminates

RT/duroid® 5870 of high frequency laminates are PTFE composites reinforced with glass microfibers. These microfibers are randomly oriented to maximize the benefits of fiber reinforcement in the direction most valuable to circuit producers and in the final circuit applications.

RT/duroid® Laminates

RT/duroid® 5880 Laminates

RT/duroid® 5880 high frequency laminates are PTFE composites reinforced with glass microfibers. These microfibers are randomly oriented to maximize the benefits of fiber reinforcement in the direction most valuable to circuit producers and in the final circuit applications.

RT/duroid® Laminates

RT/duroid® 5880LZ Laminates

RT/duroid® 5880LZ filled PTFE composites are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performance weight sensitive applications.

RT/duroid® Laminates

RT/duroid® 6002 Laminates

RT/duroid® 6002 microwave materials are a low dielectric constant laminate offering electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

RT/duroid® Laminates

RT/duroid® 6006 & 6010 Laminates

RT/duroid® 6006 microwave laminates are ceramic-PTFE composites designed for electronic and microwave circuit applications requiring a high dielectric constant.

RT/duroid® Laminates

RT/duroid® 6035HTC Laminates

RT/duroid® 6035HTC high frequency materials are ceramic filled PTFE composites for use in high power RF and microwave applications.

RT/duroid® Laminates

RT/duroid® 6202 Laminates

RT/duroid® 6202 high frequency circuit materials are a low loss and low dielectric constant laminate offering electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable.

RT/duroid® Laminates

RT/duroid® 6202PR Laminates

RT/duroid® 6202PR high frequency circuit materials are low loss and low dielectric constant laminates offering superior electrical and mechanical properties essential in designing complex microwave structures which are mechanically reliable and electrically stable and used for planar resistor applications.

TMM® Laminates

Rogers TMM® thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and dielectric constant uniformity. Due to their electrical and mechanical stability, TMM high frequency laminates are ideal for high reliability stripline and microstrip applications. When compared to alumina substrates, TMM laminates offer key fabrication advantages since it is available copper clad in larger formats, allowing the use of standard PCB subtractive processes

TMM is available in a wide range of dielectric constants ranging from 3 to 13 and available in thicknesses ranging from .015 to .500 in with a thickness tolerance of plus or minus .0015 in.

Benefits

  • Wide range of dielectric constants, Excellent mechanical properties. Resists creep and cold flow
  • Exceptionally low thermal coefficient of dielectric constant, Coefficient of thermal expansion matched to copper allowing for high reliability of plated through-holes
  • Resistant to process chemicals. No damage to material during fabrication and assembly processes
  • Thermoset resin for reliable wirebonding, No specialized production techniques required.
  • TMM 10 and 10i laminates can replace alumina substrates, RoHS compliant, environment friendly

TMM® Laminates

TMM® 3 Laminates

  • Dielectric constant of 3.27 (+/- 0.032)
  • Dielectric constant thermal coefficient of +37 (typical)
TMM® Laminates

TMM® 4 Laminates

  • Dielectric constant of 4.50 (+/- 0.045)
  • Dielectric constant thermal coefficient of +15 (typical)
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